News
Anaheim, Ca 47th DAC, June 15, 2010
E-System Design participates in GSA's 3D packaging event at DAC
More info
Atlanta, Ga 3D System Integration Workshop, June 14 and 15, 2010
More info
Anaheim, Ca 47th DAC, June 13-18, 2010
E-System Design announces 3DEXT prototype tool for 3D packaging
Press Release
Anaheim, Ca 47th DAC, June 13-18, 2010
E-System Design releases Sphinx for Signoff 64 bit version
Press Release
SPI Tutorial uses IdEM and Sphinx by Stefano Grivet-Talocia, May 9-12, 2010
More info
Sphinx chosen as Golden Mousetrap Finalist, April 9, 2010
Read Design News Announcement
Sphinx V2.5 Released, April 4, 2010
Read Press Release
Semiconductor International hosts a Webcast on Silicon Interposers with TSVs and Thin-Film Capacitors, March 17, 2010
Aaron Hand, Editor in Chief at Semiconductor International, moderates a webcast that includes Prof. Swaminathan.
View webcast
3D Incites discussion with E-System Design, February 8-12, 2010
Francoise von Trapp moderates a discussion with Prof. Swaminathan on: "TSV: is it a wire or a device?"
View dialog
Santa Clara, Ca February 4, 2010
Graham Bell, EDACafe, interviews "Ski" at DesignCon 2010 about Sphinx"
View video interview
Santa Clara, Ca February 2-3, 2010
E-System Design attended DesignCon and had many attendees visit our booth to view Sphinx, a 2010 DesignVision Finalist product
View Pictures
Santa Clara, Ca January 12, 2010
“The IEC is pleased to name E-System Design’s Sphinx as one of the most beneficial
contributions to the electronic design industry as a 2010 DesignVision Finalist," stated IEC President John R. Janowiak.
"This year’s DesignVision Awards received a record-breaking 105 submissions and we welcome industry professionals to
learn more of this impressive design solution at DesignCon 2010.”
Read entire DesignCon Award Press Release
Daejeon, Korea January 14-15, 2010
E-System Design presents 3D material at 3D IC Workshop 2010 at KAIST
Hsinchu, Taiwan January 11, 2010
E-System Design presents Power/Signal Integrity and 3D tutorial at ITRI's campus
View Pictures
Atlanta, Ga January 5, 2009
Bryon Moyer interviews E-System Design's CTO, Prof. Swaminathan, on his research and findings concerning 3D applications (PiP, PoP, SiP).
China January 2010
Prof. Swaminathan's book "Power Integrity Modeling and Design for Semiconductors and Systems" translated and released in China"
Japan January 2010
Prof. Swaminathan's book "Power Integrity Modeling and Design for Semiconductors and Systems" translated and released in Japan"
Bangalore, India December 21, 2009
E-System Design presents full day SI/PI seminar
as part of their Power Integrity World Tour.
View Pictures
Hong Kong December 2-4, 2009
E-System Design presents half day SI/PI seminar
as part of their Power Integrity World Tour at EDAP Conference.
View Pictures
Atlanta, Ga November 20, 2009
Andy Shaughnessy, Editor PCB Design007 and Eric Bogatin interview
E-System Design's CTO, Prof Swaminathan, about E-System Design,
SI/PI products and future products for 3D packaging analysis.
Listen to audio.
Atlanta, Ga October 22, 2009
E-System Design presents short tutorial on 'IC and Board Simulation: Are You
Seeing the Whole Picture?' at PCB Atlanta 2009 Conference.
Portland, Or October 19-21, 2009
E-System Design presents paper and exhibits at Electrical
Performance of Electronic Packaging and Systems (EPEP) Conference.
Atlanta, Ga September 2009
E-System Design Startup Profile in Semiconductor Times Vol 14 Issue 9, Pages 4-5
Atlanta, Ga September 1, 2009
E-System Design CTO Prof. Swaminathan interviewed on Sphinx Field Solver for IC Journal article
San Jose, Ca July 31, 2009
E-System Design CTO Prof. Swaminathan presents seminar to ~80 engineers from multiple companies in San Jose, Ca.
View Pictures
San Francisco, Ca July 26-31, 2009
E-System Design exhibits at 46th DAC with first product Sphinx
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Atlanta, Ga and Turin, Italy July 27, 2009
E-System Design and IdemWorks Announce a New Combined Design Flow and Mutual OEM Distribution
Agreement
New design flow allows electronics systems designers to confidently and accurately simulate
Signal and Power Integrity in both the frequency and time domains.
Atlanta, Ga, 24 July 2009
E-System Design Unveils Integrated Signal and Power Integrity
Co-Simulator for IC Packaging, Printed Circuit Board and System Design
New Breakthrough Product “Sphinx” Provides Visibility into Complete IC
Package and PCB Designs, Including 3D SiP, Complex PCB and System Signoff.
Thank you for visiting us at:
DAC 2010
2010 DesignCon
2009 IEEE EDAP Systems Symposium
PCB Atlanta 2009
2009 IEEE 18th EPEP
DAC 2009
