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About E-System Design

E-System Design's focus is on the development of EDA tools for enabling System Integrity through Signal and Power Co-simulation of complex, high speed and highly integrated IC packages, printed circuit boards and systems that ensures first pass success and fast design closure. E-System Design is also the first company to provide leading edge EDA solutions for System in Package (SIP) technologies.

E-System Design was founded in March, 2009 by leading Semiconductor, EDA and best in class Signal Integrity experts  Much of our technology is a result of years of leading edge SIP and SOP research at Georgia Institute of Technology (Georgia Tech).

E-System Design has established key relationships with leading EDA, semiconductor and systems companies.

Our initial product is Sphinx signal and power co-simulator which is a best in class EDA analysis tool.  But our future doesn't stop there. We are already building better and more accurate simulation products for helping companies design faster, smaller and more exciting silicon and system products.

Management 

The executive management team at E-System Design is a balanced and experienced team with many years in the Semi-conductor and EDA marketplace. E-System Design has an outstanding balance of technological research, product engineering, sales distribution, product marketing, and most importantly, leadership.

Gene Jakubowski - CEO

Is a 30 year semiconductor and EDA industry veteran. Prior to joining E-System Design, Inc., he most recently held executive positions with Discera, Inc. as VP of Worldwide Sales and during his tenure with Zeevo, Inc. as VP of WW Sales, VP of Marketing, and VP of Operations. Prior to joining Zeevo, Inc. in 2000, and helping to raise over $100 Mil in Venture backed funding, he held positions with VLSI Technology, Inc. for 14 years, 9 years as a Vice President of various market segments and business units which included Sales and ASIC Technology Center responsibilities among them, VP of Central Business Unit, VP of Eastern Business Unit, VP of Digital Consumer Electronics BU, and VP of PC Products BU. VLSI Technology, Inc. was the largest standard cell manufacturer and one of the largest EDA software providers in the industry during this time frame. He graduated from Worcester Polytechnic Institute in 1978 with a BS in Engineering Management with Distinction, and joined Texas Instruments MOS Memory Marketing as a Product Marketing Engineer in August 1978. He held various positions with Texas Instruments including Product Marketing Engineer, Product Marketing Mgr., Field Sales Engineer, and ASIC Specialist, until joining VLSI Technology, Inc. as an Area Sales Manager in 1986.

Madhavan Swaminathan, PhD - Chief Technology Officer

He is also the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering and Director of the Interconnect and Packaging Center, an SRC Center of Excellence @ Georgia Tech. He was the Deputy Director of the Microsystems Packaging Research Center, Georgia Tech from 2004 - 2008. He is the co-founder of Jacket Micro Devices, a leader in integrated RF modules and substrates for wireless applications and founder of E-System Design. Prior to joining Georgia Tech, he was with IBM working on the packaging for supercomputers. He is the author of more than 300 journal and conference publications, holds 17 patents, and is the author of two books entitled "Power Integrity Modeling and Design for Semiconductors and Systems", ISBN 0_13_615206_6. Prentice Hall, Nov 2007 and "Introduction to System on Package", ISBN 978-0-07-145906-8, McGraw Hill, Mar. 2008. He is an IEEE Fellow and has been recognized for his research through several awards including the 2007 Technical Excellence Award from the Semiconductor and Global Research Corporation (SRC/GRC). He received his M.S and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

 

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