678 296 3772
Sign Up Upcoming Events Buy Now

News

April 4, 2016
Johann Knechtel and Jens Lienig present tuturial at ISPD 2016: "Physical Design Automation for 3D Chip Stacks - Challenges and Solutions"

Tutorial
ISPD website

February 19, 2016
Riko Radojcic's 3DIncite's blog: "Intercepting IC Products with a Disruptive Technology Option"

Article

January 7, 2016
Ed Sperling's Semiconductor Engineering "Thinking Outside The Chip"

Article

January 14, 2016
3DIncites post Bill Martin's "A Perfect Storm is Brewing for Complex Packaging in 2016"

Article

3D ASIP Conference Dec 15-17th, 2015 San Francisco, Ca
Bill Martin to present

For more information

EDAPS Conference Dec 14-16th, 2015 Seoul, Korea
Dr. Swaminathan to present

For more information

EPEPS 2015 Oct 25-28, 2015 San Jose, Ca
Bill Martin presents paper "Modeling of Power Distribution Networks for Path Finding" and E-SystemDesign exhibits Sphinx 3DPF

For more information

Zuken Innovation World (ZIW) Oct 15-16th, 2015 Yokohama, Japan
CEO Gene Jakubowski to present "Optimizing Advanced Package Design with Path Finder"

Zuken website

October 6, 2015
3DIncites post Bill Martin's "PDN Noise: PDN and Signal"

Article

September 10, 2015
3DIncites post Bill Martin's "PDN Design, Target Impedance and Path Finding for IC, Package, and PCB"

Article

June 24, 2015
3DIncites and Semiconductor Packaging News post Bill Martin's "Path Finding and 3DPF"

Article

Zuken Innovation World (ZIW) 2015 June 1-3, 2015 San Diego, Ca
Bill Martin to present "Optimizing Advanced Package Design with Path Finder"

Program

ECTC 2015 May 26-29, 2015 San Diego, Ca
E-System Design exhibits Sphinx 3DPF V4.0

More info

May 5, 2015
SEMI posts Bill Martin and Paul Werbaneth's "IoT Requires the Evolution of the "New" 200mm Fab"
Article

March 20, 2015
3DIncites and Semiconductor Packaging News post Bill Martin's "Is Complex Packaging in High Volume Manufacturing (HVM)?"
Article

February 25, 2015
3DIncites posts Bill Martin's "RIP ITRS V1.0: 1992-2015"
Article

February 19, 2015
3DIncites posts Bill Martin's "Can Path Finding be used in the Production Environment?"
Article

February 11, 2015
EETimes posts Packy Kelly from KPMG blog about Moore's Law Chips Confidence"
Article

February 5, 2015
3DIncites posts Bill Martin's "Micro vs. Macro 3D IC Cost Analysis: Can we learn from the mid 1980's?"
Article

February 2, 2015
Solid State Technolog posts Pete Singer's blog about Reframing the Roadmap: ITRS 2.0"
Article

January 22, 2015
3DIncites posts Bill Martin's "Path Finding Series Part 3: The Cost of Non-robust Design"
Article

January 5, 2015
3DIncites posts Gene Jakubowski's "2015 Industry Outlook: EDA Reaches an Inflection Point"
Article

December 30, 2014
3DIncites posts Bill Martin's "Path Finding Series Part 2: Robust Design"
Article

Various 3D ASIP Conference media coverage links:
3DIncites December 15th
SemiWiki December 1st
SemiWiki December 11th
SemiWiki December 12th
Semiconductor Manufacturing and Design December 12th

December 10, 2014
3DIncites posts Bill Martin's "Path Finding Series Part 1: NOT a One-trick Pony"
Article

December 10-12th, 2014 3D ASIP Conference Burlingame, Ca
Herb Reiter hosted 1/2 day 2.5/3D seminar "pre conference"

Program

November 14, 2014
3DIncites posts Bill Martin's "Can Product Design learn a Trick from Manufacturing?"
Article

November 10, 2014
Chip Design posts Bill Martin's "Path Finding V1.0 vs. V2.0"
Article

November 1, 2014
Bill Martin updates Path Finding videos on YouTube
Videos

October 26-29, 2014 EPEPS 2014 Portland, Or
E-System Design exhibited Sphinx 3DPF V4.0

More info

October 21-23, 2014 ITC 2014 Seattle, Wa
Professor Swaminathan presented invited paper: Managing Signal, Power and Thermal Integrity for 3D Integration

More info

October 17, 2014
3DIncites posts Bill Martin's "Exploring Viable Path Finding"
Article

October 15, 2014
Semiconductor Manufacturing & Design posts Bill Martin's "Are we at an inflection point with silicon scaling and homogeneous ICs?"
Article

October 15, 2014
Chip Design posts Bill Martin's "Are we at an inflection point with silicon scaling and homogeneous ICs?"
Article

October 1, 2014
3DIncites posts Bill Martin's "Are Path Finding Tools the Missing Link?"
Article

August 28, 2014
Korean Display+ website carries Sphinx 3DPF V3.0 release
Website

August 27, 2014
3DIncites Francoise von Trapp (FvT) article "Will 2.5D and 3D Stacking Save the Semiconductor Industry?"
Article

August 7, 2014
Semiconductor Engineering article written by Brian Bailey: "When Will 2.5D Cut Costs?"
Article

August 7, 2014
EETimes article discusses PCB inspection company M&A of a Semiconductor etch and deposition company that was driven by Advanced Packaging (2.5/3D).
First of many to come?
Article

August 1, 2014
Semiconductor Engineering article "IP and FinFETS at Advanced Nodes" with Bill Martin's response "To TSV or not to TSV"
Article and Response

August 1, 2014 Austin, Tx
3DIncites publishes report from GSA's 3DIC Packaging meeting
3DIncites update

July 28,2014 Dallas, Tx
EETimes publishes "Think Different, Innovate by Reuse" opinion by Bill Martin
Opinion Blog

August 2014 Austin, Tx
TechSearch International Inc. releases "3D IC Gap Analysis: Remaining Issues, Solutions, Market Status".
Report discusses ecosystem and new tool category "Path Finding" that helps navigate 2.5/3D technology landscape. E-System Design and Sphinx 3DPF are mentioned in report.
TechSearch data sheet and how to order

July 30, 2014 Atlanta, Ga
E-System Design releases Sphinx 3DPF V3.0 to market after working several years with leading companies
Business Wire Press Release

July 23, 2014 Sunnyvale, Ca
Bill Martin presents E-System Designs' "Role of Path Finding?" to GSA's 3D-IC Packaging Working Group
GSA's website and PDF

July 10, 2014 SEMICON West, San Francisco, Ca
3D Incites' judges award Sphinx 3D Path Finder ("3DPF") as Best New 2.5/3D Design Tool for 2014!
Article


          Award            Sungmin accepts from Francoise
                      Images Courtesy of 3D Incites

June 12, 2014 EDACafe
Bill Martin's response "DAC 2014: Advanced nodes and going back in time for a solution"
Article

June 12, 2014
Nikkei Electronics' Kojima-san covers Qualcomm/E-System Design DAC paper:
"Electrical Path Finding for 3D Integration"
Nikkei Electronic (Japanese link)

June 10, 2014 3D Incites' ECTC Blog
Francoise von Trapp blog: "Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?" At an ECTC evening panel discussion, Francoise helps to spread Path Finding tools are a reality (FvT: thank you!)

3D Incite's Francoise Blog

June 2014 Desktop Engineering
Nicholas M. Veikos: "The Importance of Engineering Simulation for Innovation"

Article

June 2014 Desktop Engineering
Jamie J. Gooch: "Seeing is Understanding"

Article

June 6, 2014 3D Incites' ECTC/DAC Blog
Herb Reiter blog: "ECTC 2014: Should EDA vendors, OSATS, and their customers cooperate more?"
Highlights E-System Design as one of two EDA companies that attended both ECTC and DAC.
At ECTC, E-SD exhibited and presented a poster session. At DAC, Qualcomm co-authored a paper with E-SD on electrical path finding

3D Incites' Herb Blog

DAC 2014 June 3, 2014, San Francisco, Ca
Qualcomm and E-System Design present paper on Electrical Path Finding

Poster

June 2, 2014 3D Incites' ECTC Blog
Francoise von Trapp blog: "ECTC 2014: Bridging the Gap to 2.5D and 3D" Highlights E-System Design and Sphinx 3DPF V3.0 as an EDA solution helping to explore 2.5/3D alternatives.

3D Incites' Francoise Blog

June 2, 2014
Sphinx "3DPF" V3.0 nominated for 3D Incites Awards recognizing innovative products to accelerate 2.5/3D

3D Incites' Nomination

ECTC 2014 May 29, Lake Buena Vista, Fl.
Dr. Swaminathan was awarded the 2014 IEEE CPMT Outstanding sustaned Technical Contribution Award
"For significant and sustained contributions that have helped shape the design aspects of packaging in the areas of power delivery, System on Package (SOP) technologies and 3D Integration."

ECTC 2014 May 28-29, Lake Buena Vista, Fl.
Bill Martin presented poster session titled:
A Path Finding Based SI Design Methodology for 3D Integration

Poster with V2.0
Poster with V3.0

DesignCon January 28, Santa Clara, Ca.
Dr. Madhavan Swaminathan participated in DesignCon 2014 tutorial:
High Density, High Performance Package and 2.5D/3D Interconnect Design,

More Info

January 28, 2014, Atlanta, Ga
3D Incites posts longer book review (including examples) on Professors Swaminathan and Han's book:
Design and Modeling for 3D ICs and Interposers

Review

January 27, 2014, Atlanta, Ga
SemiWiki posts short book review on Professors Swaminathan and Han's book:
Design and Modeling for 3D ICs and Interposers

Review

December 2013, Atlanta, Ga
IEEE Electromagnetic Compatibilty Magazine reviews Professors Swaminathan and Han's book:
Design and Modeling for 3D ICs and Interposers

IEEE EMC Book Review

December 18, 2013, Bhubaneswar, India
IEEE AEC 2013 Conference December 18-20 at KIIT University
Dr. Swaminathan will present a tutorial: "Applied Electronmagnetics for Advanced Packaging"

For more information

December 15, 2013, Nara, Japan
EDAPS 2013 Conference December 12-15
Dr. Swaminathan will give keynote: "Devices, Circuits, Packages and Systems: Understanding their Interplay for Managing Signal, Power and thermal Integrity"

For more information

November 16, 2013, Ottawa, Ontario
HPCPS 2013 Conference November 16 at Carleton University
Dr. Swaminathan will give keynote: "Devices, Circuits, Packages and Systems: Understanding their Interplay for Managing Signal, Power and thermal Integrity"

For more information

Dallas, Tx October 14, 2013
Bill Martin publishes article "3D technologies: Help for ?The Lost Generation?" in EDACafe. Article discusses 4 generations of technology advancement and how 3D might save the 4th generation.

Article

Denver,Co August 9, 2013
EMC 2013 Conference August 5-9
Dr. Swaminathan presents several tutorials/papers on August 9th

More Info

Atlanta, Ga June 27,2013
Dr. Swaminathan has a new book available in September 2013!

Design and Modeling for 3D ICs and Interposers

Dallas, Tx June 24,2013
Path Finding videos are posted on E-System Design's website

To see all Papers/Videos

Dallas, Tx June 2013
Bill Martin publishes article in GSA Forum about Path Finding:Who Performs and When?. This high level paper describes what companies might want to explore path finding.

Entire GSA Forum magazine
Path Finding Article only

DAC 2013, June 4,2013 from 3:30-3:45pm, Austin, Tx
Dr. Swaminathan will host panel:
"Is This the Right Time to Create Standards for 2.5D/3D-IC Designs?"

For more information

May 24th, The University of Adelaide, Australia
Dr. Swaminathan will present: "Micro and Nano miniaturization of systems" for IEEE SA Chapter on Antennas and Propagation and Microwave Theory and Techniques (AP/MTT)

Flyer

May 22nd, The University of Melbourne, Australia
Dr. Swaminathan will present: "Micro and Nano miniaturization of systems"

Hopkinton, Ma May 2, 2013
Dr. Swaminathan will present: Designing for Power Integrity: Status, Challenges and Opportunities
at IEEE EMC Chapter at EMC Corp. - 228 South St., Hopkinton, Ma
For more information please contact Boris Shusterman at boris.shusterman@emc.com , tel. 508-249-5020

Monterey, Ca April 23, 2013
Richard Goering coverage of 3DIC panel moderated by Gene Jakubowski at EDPS 2013 conference.
Article

Monterey, Ca April 18, 2013
Ski Jakubowski hosts EDPS panel: 3D-ICs - Are We There Yet?
EDPS Program

Dallas, Tx March 2013
Bill Martin publishes article in GSA Forum about 2.5/3D Path Finding. This high level paper describes Path Finding and how it can be utilized long before costly implementation.
Entire GSA Forum magazine
Path Finding Article only

Anaheim, Ca January 14, 2013
Sphinx 3D Path Finder has been selected as a finalist in Design News' annual Golden Mousetrap Awards in the Design Tools - Hardware & Software: Analysis and Calculation Software category.

GSA IP Blog, Dallas, Tx Jan 6, 2013
Bill Martin wrote short IP Blog titled: Brave New World: 2.5/3D packaging impact on IP?
More info

VLSI Design, Pune, India Jan 5-10th, 2013
Dr. Swaminathan presents a tutorial titled: Designing for Power Integrity: Status, Challenges and Opportunities
More info

EDAPS Taipei, Taiwan, Dec 9-11, 2012
Dr. Swaminathan presents a tutorial
More info

Atlanta,Ga, October 25, 2012
Dr. Swaminathan has accepted the position of the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering at Georgia Tech."
Article

Atlanta,Ga, July 20, 2012
Dr. Swaminathan interviewed by Brian Bailey (EDN) on his 3D research. Blog article is titled "3D and power is all wet"
Article
Sphinx3D Path Finder

Atlanta,Ga, July 7, 2012
Dr. Swaminathan interviewed by Francoise von Trapp on his 3D research. Article is titled "The Flip Side of the Glass Interposer Coin"
Article

San Diego, Ca, June 1, 2012
Dr. Swaminathan has keynote address at ITherm 2012 titled "Multi-physics Modeling - Its Role in the Engineering of Future Micro and Nano-systems"
More info

San Diego, Ca, May 31, 2012
Dr. Swaminathan presents "Fast Electrical-Thermal Co-Simulation using Multigrid Method for 3D Integration"
More info

San Jose, Ca, April 11, 2012
Dr. Swaminathan presented at Workshop on Accelerating 3D Package Path Finding. Workshop was held at Altera's Headquarters.
More info

Santa Clara, Ca, March 1, 2012
Dr. Swaminathan awarded Best Paper in Power and RF Design category.

Paper's title: "Are Power Planes Necessary for High Speed Signaling?" and was co-authered by Suzanne L. Huh from Intel Corporation
Paper Awards

Download Paper

Santa Clara, Ca, January 30-February 2, 2012
Dr. Swaminathan presented 2 papers at DesignCon.
First is titled: "Electrical Design and Modeling Challenges for 3D System Integration"
Second is titled: "Are Power Planes Necessary for High Speed Signaling?"
More info

Hangzhou, China, December 12-14, 2011
Dr. Swaminathan participated at EDAPS Symposium.
More info

Singapore, December 7-9, 2011
Dr. Swaminathan taught "Signal and Power Integrity for Electronic Packaging" at EPTC 2011.
More info

Atlanta, Ga, November 14-15, 2011
Dr. Madhavan Swaminathan presented paper at Global Interposer Technology Workshop.
More info
Paper abstract

San Jose, Ca, October 23-26, 2011
Dr. Swaminathan participated on EPEPS panel: "Key Challenges and Future Directions for Design & Analysis of High-Speed Electronic Packages and Interconnects".
More info

Santa Clara, Ca, September 19-20, 2011
Bill Martin discussed E-System Design's solution for complex package design at CPCW 2011.
More info

Atlanta, Ga, August 31, 2011
Dr. Madhavan Swaminathan selected to be IEEE EMC Society Distinguished Lecturer for the two year term 2012-2013.

Atlanta, Ga, July/August, 2011
Dr. Swaminathan wrote article for Chip Scale Review Magazine titled: Package Design: A Performance Killer or a Savior?
Read article (page 52)

San Diego, Ca, June 6-8th, 2011
E-System Design attended and demostrated Sphinx 3DEXT, a 3D interconnect extraction/simulation product supporting TSVs, Column Grid Arrays and Wire Bonds.
Download GSA's DAC2011 3D Tour Guide

Monterey, Ca, April 7-8th, 2011
IEEE Electronic Design Processes (EDP) workshop addresses 3D Packaging. Bill Martin discussed E-System Design's solutions concerning TSVs, CGAs and Wire Bonds.
See Richard Goering's blog and pictures

Santa Clara, Ca, February 2, 2011
Dr. Eric Bogatin interviewed Greg Fitzgerald concerning E-System Design's products.
See video interview

Santa Clara, Ca, February 1, 2011
E-System Design announced SphinxDC is included in their Advanced Analysis Kits.
Press Release

learn more / Follow Us on

Home    |    Technology    |    Products    |    News    |    Sales/Contact    |    Customer Login    |    Papers/Videos    |    About Us    |    Site Map