Sphinx 3DEXT

3D interconnects (TSVs, Column Grid arrays and wire bonds) require special analysis since their physical structures can lead to skin, proximity, slow wave and dielectric effects.

Sphinx 3DEXT solves this issue

The benefits of Sphinx 3DEXT include:

• Supporting multiple 3D structures for IC stacking and interposer that include TSV, Column Grid arrays, Wire Bond, flex interconnects and custom designed structures
• Supporting arrayed, staggered and custom configurations
• Allowing users to create complex (side) profiles for vias
• Allowing users to create detailed Wire Bond structures especially when they crisscross in a 3D stack
• Allowing users to try various configurations and determine proximity effects based on signal:ground ratio long before implementation begins (pathfinding)
• Assessing impact of package on 3D stack using the Sphinx platform
• Outputting: RLCG files, currect density and Touchstone files that can be converted to Spice netlists using IdEM Plus

20x20 TSV Array's Insertion Loss

9x9 TSV Array's Crosstalk

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