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Sphinx 3D Path Finder V4.0

One common GUI with multiple analysis engines are available for users:

V4.0 builds upon the successes of previous releases and becomes an analysis platform with a common GUI but backed by accurate and fast analysis engines for different types of structures. User can easily construct various silicon or non silicon structures in minutes using any of the following: RDL/Planes, vias and/or TSVs, bond wires. Once building blocks are created, the user can stack these to create more complex 2.5 or even 3D structures, port the structure and perform analysis. Silicon based structures require special analysis since their physical structures can lead to skin, proximity, slow wave and dielectric effects.

3DPF creates industry standard Touchstone files.

3DPF Technical Paper



The benefits of Sphinx 3DPF V4.0 include:
  • Supports multi-layered 3D interconnect structures used for 2D, 2.5D and 3D integration
    which include wirebond, ball, pillar, through silicon via and RDL
  • Lego block approach allows users can quickly construct: Inteconnect, Interposer and PDN path finding structures
  • Supporting arrayed, staggered and custom configurations of vias for easy generation
  • Via modeling recognizes lossy and lossless substrate materials for accurate analysis
  • Users can define their own via, ball and pillar profiles. Wire bonds support JEDEC4 and 5 profiles
  • Memory efficient algorithm accelerates analysis with minimum computational time for analyzing complex structures
  • Engines can use parallel computing significantly reducing time to analyze
  • Ensures accuracy through electromagnetic analysis that accounts for complex parasitic effects based
    on current flow and charge distribution for both semiconduting and insulating substrates
  • Includes temperature effects for semiconducting substrates
  • Supports industry standard Touchstone file generation
  • Supports frequency dependent RLGC parasitic generation for via structures
  • Enables Spice netlist generation (through IdEM) for time domain analysis
  • Allows memory efficient analysis with minimum computational time for analyzing complex structures
  • Ensures accuracy through electromagnetic analysis that accounts for complex parasitic effects based
    on current flow and charge distribution for both semiconduting and insulating substrates
  • Includes temperature effects for semiconducting substrates
  • Supports industry standard Touchstone file generation
  • Supports frequency dependent RLGC parasitic generation for via structures
  • Enables Spice netlist generation (through IdEM) for time domain analysis

20x20 TSV Array's
Insertion Loss

9x9 TSV Array's
Crosstalk





2.5/3D System including:
CGA, TSV, RDL,
BGA ball and bond wires

2.5/3D System including:
CGA, TSV, RDL,
BGA ball and bond wires

Sphinx 3D PF V4.0 datasheet


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